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IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
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IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

PUBLISH DATE 2021
PAGES 68
IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use

Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards.

This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components.

These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3, and IEC 61191-4.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date Feb. 1, 2021
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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