Logo
Login Sign Up
Current Revision

IEC 61188-6-2 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Best Price Guarantee

$262.00

2-5 Days

$262.00

SAVE 10%

$471.60


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 61188-6-2 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

PUBLISH DATE 2026
IEC 61188-6-2 Ed. 1.0 b:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191 2:2017.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date April 1, 2026
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61188-6-2 Ed. 1.0 b:2021 Revision
Feb. 1, 2021 Revision