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IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
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IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

PUBLISH DATE 2026
IEC 61188-6-3 Ed. 1.0 b:2024
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date April 1, 2026
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61188-6-3 Ed. 1.0 b:2024 Revision