Logo
Login Sign Up
Current Revision

IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Best Price Guarantee
Instant

$328.79

2-5 Days

$328.79

SAVE 10%

$591.82


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

IEC 61188-6-3 Ed. 1.0 b:2024

IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.

The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date Not Available
Language b - English & French
Page Count 66
Revision Level 1.0
Supercedes
Committee 91
Loading...

Failed to load document history.

Publish Date Document Id Type View