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IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
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IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

PUBLISH DATE 2019
PAGES 86
IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design.

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.

The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing, as well as to improve the utilization of IEC 61188 series.

This document is applicable to the SMD of semiconductor devices and electrical components.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date May 1, 2019
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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