IEC 61189-1 Ed. 1.1 b:2001

Current Revision
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Best Price Guarantee Nov 1, 2001 EN/FR 60 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

PUBLISH DATE 2001
PAGES 60

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology.

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture.

This part contains test methods for evaluating printed boards and other forms of interconnection structures.

The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Loading...

Failed to load document history.

Publish Date Document Id Type View