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IEC 61189-1 Ed. 1.1 b:2001

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IEC 61189-1 Ed. 1.1 b:2001

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

PUBLISH DATE 2001
PAGES 60
IEC 61189-1 Ed. 1.1 b:2001

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology.

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture.

This part contains test methods for evaluating printed boards and other forms of interconnection structures.

The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Nov. 1, 2001
Language b - English & French
Page Count
Revision Level 1.1
Supercedes
Committee 91
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