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IEC 61189-11 Ed. 1.0 b:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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IEC 61189-11 Ed. 1.0 b:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

PUBLISH DATE 2013
PAGES 34
IEC 61189-11 Ed. 1.0 b:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies

Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date May 7, 2013
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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