IEC 61189-2-501 Ed. 1.0 b:2022

Current Revision
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Best Price Guarantee Feb 1, 2022 EN/FR 36 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

PUBLISH DATE 2022
PAGES 36

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials.

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials.

This method determines the resilience under specified conditions.

The test is performed on the sample as manufactured and without conditioning.

The test does not apply to the resilience force lower than 10 mN.

Loading...

Failed to load document history.

Publish Date Document Id Type View