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IEC 61189-2-501 Ed. 1.0 b:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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IEC 61189-2-501 Ed. 1.0 b:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

PUBLISH DATE 2022
PAGES 36
IEC 61189-2-501 Ed. 1.0 b:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials.

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials.

This method determines the resilience under specified conditions.

The test is performed on the sample as manufactured and without conditioning.

The test does not apply to the resilience force lower than 10 mN.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Feb. 1, 2022
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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