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IEC 61189-2-720 Ed. 1.0 b:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
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IEC 61189-2-720 Ed. 1.0 b:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

PUBLISH DATE 2024
PAGES 26
IEC 61189-2-720 Ed. 1.0 b:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date March 1, 2024
Language b - English & French
Page Count 26
Revision Level 1.0
Supercedes
Committee 91
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