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IEC 61189-2-721 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
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IEC 61189-2-721 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

PUBLISH DATE 2015
PAGES 48
IEC 61189-2-721 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator.

IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).

IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date April 29, 2015
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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