IEC 61189-2-801 Ed. 1.0 b:2023

Current Revision
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

PUBLISH DATE 2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating.

The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

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