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IEC 61189-2-803 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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IEC 61189-2-803 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

PUBLISH DATE 2024
IEC 61189-2-803 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards.

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date June 5, 2024
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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