IEC 61189-2-804 Ed. 1.0 b:2023

Current Revision
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Best Price Guarantee Aug 1, 2023 EN/FR 20 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

PUBLISH DATE 2023
PAGES 20

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA).

Temperatures used for this evaluation are typically 260 °C, 288 °C, and 300 °C, but are not limited to these values.

Loading...

Failed to load document history.

Publish Date Document Id Type View