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IEC 61189-2-804 Ed. 1.0 b:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
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IEC 61189-2-804 Ed. 1.0 b:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

PUBLISH DATE 2023
PAGES 20
IEC 61189-2-804 Ed. 1.0 b:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA).

Temperatures used for this evaluation are typically 260 °C, 288 °C, and 300 °C, but are not limited to these values.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Aug. 1, 2023
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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