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IEC 61189-2-805 Ed. 1.0 b:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
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IEC 61189-2-805 Ed. 1.0 b:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

PUBLISH DATE 2024
PAGES 24
IEC 61189-2-805 Ed. 1.0 b:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA).

This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date April 1, 2024
Language b - English & French
Page Count 24
Revision Level 1.0
Supercedes
Committee 91
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