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IEC 61189-2-807 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
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IEC 61189-2-807 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA

PUBLISH DATE 2021
PAGES 22
IEC 61189-2-807 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA.

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Sept. 1, 2021
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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