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IEC 61189-2-808 Ed. 1.0 b:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
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IEC 61189-2-808 Ed. 1.0 b:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

PUBLISH DATE 2024
PAGES 44
IEC 61189-2-808 Ed. 1.0 b:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode.

This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.

NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date April 1, 2024
Language b - English & French
Page Count 44
Revision Level 1.0
Supercedes
Committee 91
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