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IEC 61189-2-809 Ed. 1.0 b:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
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IEC 61189-2-809 Ed. 1.0 b:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

IEC 61189-2-809 Ed. 1.0 b:2024

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).

This method is applicable to materials that are solid over the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Not Available
Language b - English & French
Page Count 22
Revision Level 1.0
Supercedes
Committee 91
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