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IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

PUBLISH DATE 2006
PAGES 128
IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date May 1, 2006
Language en - English
Page Count
Revision Level 2.0
Supercedes
Committee 91
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