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IEC 61189-3-302 Ed. 1.0 b:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Not Available
Language b - English & French
Page Count 38
Revision Level 1.0
Supercedes
Committee 91
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