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IEC 61189-3-719 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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IEC 61189-3-719 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

PUBLISH DATE 2016
PAGES 26
IEC 61189-3-719 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling.

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs).

The purpose is to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Jan. 1, 2016
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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