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IEC 61189-3-913 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
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IEC 61189-3-913 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

PUBLISH DATE 2016
PAGES 62
IEC 61189-3-913 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

The test applies to printed circuit boards for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).

This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in 2011. This edition constitutes a technical revision.

This edition focused only on the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Jan. 1, 2016
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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