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IEC 61189-5-1 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
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IEC 61189-5-1 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

PUBLISH DATE 2016
PAGES 58
IEC 61189-5-1 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date July 1, 2016
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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