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IEC 61189-5-2 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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IEC 61189-5-2 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

PUBLISH DATE 2026
PAGES 88
IEC 61189-5-2 Ed. 1.0 b:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date April 1, 2026
Language b - English & French
Page Count 88
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61189-5-2 Ed. 1.0 b:2015 Revision
Jan. 8, 2015 Revision