IEC 61189-5-2 Ed. 1.0 b:2015

Current Revision
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Best Price Guarantee Jan 8, 2015 EN/FR 88 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

PUBLISH DATE 2015
PAGES 88

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2:

General test methods for materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6.

In addition, it includes test methods of soldering flux for lead free soldering.

Loading...

Failed to load document history.

Publish Date Document Id Type View