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IEC 61189-5 Ed. 1.0 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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IEC 61189-5 Ed. 1.0 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

PUBLISH DATE 2006
IEC 61189-5 Ed. 1.0 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Aug. 1, 2006
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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