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IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

PUBLISH DATE 2002
PAGES 50
IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly.

Specifies general requirements for the classification and testing of *soldering fluxes* for high-quality interconnections in electronics assembly.

This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61190
Publication Date March 1, 2002
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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