Logo
Login Sign Up
Current Revision

IEC 61190-1-2 Ed. 3.0 b:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Best Price Guarantee
Instant

$262.00

2-5 Days

$262.00

SAVE 10%

$471.60


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 61190-1-2 Ed. 3.0 b:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

PUBLISH DATE 2026
PAGES 50
IEC 61190-1-2 Ed. 3.0 b:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61190
Publication Date April 1, 2026
Language b - English & French
Page Count 50
Revision Level 3.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61190-1-2 Ed. 3.0 b:2014 Revision
Feb. 19, 2014 Revision