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IEC 61191-1 Ed. 3.0 b:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61191-1 Ed. 3.0 b:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

PUBLISH DATE 2026
PAGES 94
IEC 61191-1 Ed. 3.0 b:2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date April 1, 2026
Language b - English & French
Page Count 94
Revision Level 3.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 Revision
Not Available Revision
Not Available Revision
April 1, 2026 IEC 61191-1 Ed. 3.0 b:2018 Revision
Sept. 1, 2018 Revision