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IEC 61191-4 Ed. 2.0 en:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
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International Electrotechnical Commission Logo

IEC 61191-4 Ed. 2.0 en:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

PUBLISH DATE 2026
PAGES 24
IEC 61191-4 Ed. 2.0 en:2017
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC A-610F.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date April 1, 2026
Language en - English
Page Count 24
Revision Level 2.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61191-4 Ed. 2.0 en:2017 Revision
July 1, 2017 Revision