IEC 61249-2-51 Ed. 1.0 b:2023

Current Revision
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

Best Price Guarantee May 1, 2023 EN/FR 38 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

PUBLISH DATE 2023
PAGES 38

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad.

Base materials for integrated circuit card carrier tape, unclad.

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, and storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).

This document is applicable to IC carrier tape base materials, which is a glue-coated material. One side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

Loading...

Failed to load document history.

Publish Date Document Id Type View