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IEC 61249-2-51 Ed. 1.0 b:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
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IEC 61249-2-51 Ed. 1.0 b:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

PUBLISH DATE 2023
PAGES 38
IEC 61249-2-51 Ed. 1.0 b:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad.

Base materials for integrated circuit card carrier tape, unclad.

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, and storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).

This document is applicable to IC carrier tape base materials, which is a glue-coated material. One side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61249
Publication Date May 1, 2023
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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