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IEC 61249-3-5 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
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IEC 61249-3-5 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

PUBLISH DATE 1999
PAGES 18
IEC 61249-3-5 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films.

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61249
Publication Date Feb. 1, 1999
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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