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IEC 61249-5-1 Ed. 1.0 b:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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IEC 61249-5-1 Ed. 1.0 b:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

PUBLISH DATE 1995
IEC 61249-5-1 Ed. 1.0 b:1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61249
Publication Date Nov. 1, 1995
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
June 5, 2024 Revision
Nov. 1, 1995 IEC 61249-5-1 Ed. 1.0 b:1995 Revision