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IEC 61760-4 Ed. 2.0 en:2026

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
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IEC 61760-4 Ed. 2.0 en:2026

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

PUBLISH DATE 2026
IEC 61760-4 Ed. 2.0 en:2026

IEC 61760-4:2026 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling, and handling.

It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document introduces additional moisture sensitivity levels and an alternative method for packaging.

This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, and devices for flow (wave) soldering.

NOTE Background of this document and its relation to currently existing standards, e.g., IEC 60749-20 or J-STD-020F and J-STD-033, are described in the Introduction.

This edition includes the following significant technical changes with respect to the previous edition:

  • a) The content is updated to cover the classification conditions given in the new editions of J-STD-020F and IEC 60068-2-58.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61760
Publication Date June 1, 2026
Language en - English
Page Count 34
Revision Level 2.0
Supercedes
Committee 91
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