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IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
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IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PUBLISH DATE 2011
PAGES 26
IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.

This standard is applicable to metallic, ceramic, and polymeric materials.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date July 1, 2011
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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