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IEC 62047-11 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
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IEC 62047-11 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

PUBLISH DATE 2013
PAGES 42
IEC 62047-11 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0.1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0.1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others.

This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30% of a material's melting temperature.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date July 1, 2013
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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