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IEC 62047-12 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
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IEC 62047-12 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

PUBLISH DATE 2011
PAGES 64
IEC 62047-12 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 12:

Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.

This standard applies to vibrating structures ranging in size from 10 ÎĽm to 1 000 ÎĽm in the plane direction and from 1 ÎĽm to 100 ÎĽm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 ÎĽm and 10 ÎĽm in thickness.

The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures.

To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established.

The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Sept. 1, 2011
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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