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IEC 62047-18 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
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IEC 62047-18 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

PUBLISH DATE 2013
PAGES 30
IEC 62047-18 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0.1 micrometre and 10 micrometre.

This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date July 1, 2013
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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