Logo
Login Sign Up
Current Revision

IEC 62047-2 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Best Price Guarantee
Instant

$100.87

2-5 Days

$100.87

SAVE 10%

$181.57


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 62047-2 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

PUBLISH DATE 2006
PAGES 34
IEC 62047-2 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography.

This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Aug. 1, 2006
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
Loading...

Failed to load document history.

Publish Date Document Id Type View