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IEC 62047-2 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
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IEC 62047-2 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

PUBLISH DATE 2006
PAGES 34
IEC 62047-2 Ed. 1.0 b:2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Aug. 1, 2006
Language b - English & French
Page Count 34
Revision Level 1.0
Supercedes
Committee 47F
Publish Date Document Id Type View
Aug. 1, 2006 IEC 62047-2 Ed. 1.0 b:2006 Revision
Aug. 1, 2006 Revision