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IEC 62047-3 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
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IEC 62047-3 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

PUBLISH DATE 2006
PAGES 24
IEC 62047-3 Ed. 1.0 b:2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.

It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range.

It also specifies the test pieces to minimize characteristics deviation among the pieces.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Aug. 1, 2006
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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