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IEC 62047-52 Ed. 1.0 en:2026

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
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IEC 62047-52 Ed. 1.0 en:2026

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS

IEC 62047-52 Ed. 1.0 en:2026

IEC 62047-52:2026 specifies a testing method for measuring device performance and failure strain under biaxial tensile deformation in stretchable MEMS materials.

The typical examples of the stretchable MEMS materials are flexible single crystalline silicon structures, MEMS circuit boards, and interconnected MEMS on a stretchable substrate.

The test piece has a cruciform geometry and the test piece thickness ranges from 1 µm to 100 µm with the same thickness as the actual devices.

Since the failure strain can vary depending on loading conditions like uniaxial tension and equi-biaxial tension, a biaxial load is applied to a cruciform test piece with varying strain ratio between two perpendicular loading directions.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Not Available
Language en - English
Page Count 16
Revision Level 1.0
Supercedes
Committee 47F
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