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IEC 62239-1 Ed. 1.0 b:2018

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
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IEC 62239-1 Ed. 1.0 b:2018

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

PUBLISH DATE 2018
PAGES 164
IEC 62239-1 Ed. 1.0 b:2018

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.

In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).

This first edition cancels and replaces IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition:

  • a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171, GEIA-STD-0005-1, GEIA STD 0008;
  • b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/subclauses for guidance purposes only;
  • c) added the analysis of component technical erratum;
  • d) updated Bibliography and reference documents.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62239
Publication Date Sept. 1, 2018
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 107
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