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IEC 62374-1 Ed. 1.0 b:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
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IEC 62374-1 Ed. 1.0 b:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

PUBLISH DATE 2010
PAGES 36
IEC 62374-1 Ed. 1.0 b:2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62374
Publication Date Sept. 1, 2010
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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