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IEC 62769-6 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
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IEC 62769-6 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

PUBLISH DATE 2023
PAGES 18
IEC 62769-6 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62769
Publication Date April 1, 2023
Language b - English & French
Page Count
Revision Level 3.0
Supercedes
Committee 65E
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