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IEC 62769-8 Ed. 1.0 b:2023

Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
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IEC 62769-8 Ed. 1.0 b:2023

Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping

PUBLISH DATE 2023
PAGES 110
IEC 62769-8 Ed. 1.0 b:2023
Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62769
Publication Date April 1, 2023
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 65E
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