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IEC 63251 Ed. 1.0 b:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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IEC 63251 Ed. 1.0 b:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

PUBLISH DATE 2023
PAGES 46
IEC 63251 Ed. 1.0 b:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
SDO IEC: International Electrotechnical Commission
Document Number IEC 63251
Publication Date Nov. 1, 2023
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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