IEC/TR 60286-7 Ed. 1.0 b:2019

Current Revision
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

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Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

PUBLISH DATE 2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components.

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller.

It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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