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IEC/TR 61191-7 Ed. 1.0 en:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
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IEC/TR 61191-7 Ed. 1.0 en:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

PUBLISH DATE 2026
IEC/TR 61191-7 Ed. 1.0 en:2020
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 61191
Publication Date April 1, 2026
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC/TR 61191-7 Ed. 1.0 en:2020 Revision
June 5, 2024 Revision