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IEC/TR 61760-5-1 Ed. 1.0 en:2024

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
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International Electrotechnical Commission Logo

IEC/TR 61760-5-1 Ed. 1.0 en:2024

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

PUBLISH DATE 2024
IEC/TR 61760-5-1 Ed. 1.0 en:2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 61760
Publication Date Jan. 1, 2024
Language en - English
Page Count 28
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
June 5, 2024 Revision
Jan. 1, 2024 IEC/TR 61760-5-1 Ed. 1.0 en:2024 Revision