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IEC/TR 62240-1 Ed. 2.0 en:2018

Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
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IEC/TR 62240-1 Ed. 2.0 en:2018

Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating

PUBLISH DATE 2026
IEC/TR 62240-1 Ed. 2.0 en:2018
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.
 
SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 62240
Publication Date April 1, 2026
Language en - English
Page Count
Revision Level 2.0
Supercedes
Committee 107
Publish Date Document Id Type View
April 1, 2026 IEC/TR 62240-1 Ed. 2.0 en:2018 Revision
June 5, 2024 Revision
Not Available Revision