IEC/TR 62866 Ed. 1.0 b:2014

Current Revision
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

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Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

PUBLISH DATE 2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration.

It details the measurement method, observation of the failure, and remarks to testing in detail.

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