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IEC/TS 62454 Ed. 1.0 b:2007

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
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IEC/TS 62454 Ed. 1.0 b:2007

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

PUBLISH DATE 2007
IEC/TS 62454 Ed. 1.0 b:2007

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series.

Provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers.

Is applicable to cabinets in accordance with the IEC 60297 (19 in) and IEC 60917 (25 mm) series.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 62454
Publication Date Oct. 1, 2007
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 48D
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