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IEC/TS 62647-2 Ed. 1.0 en:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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IEC/TS 62647-2 Ed. 1.0 en:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

PUBLISH DATE 2012
IEC/TS 62647-2 Ed. 1.0 en:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

It may be used by other high-performance and high-reliability industries, at their discretion.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 62647
Publication Date Nov. 29, 2012
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 107
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